Auto jar packing and unpacking System
본문
Model
BJKO17A-OHT
The Auto Jar Packing System automatically transfers and packs 2-300mm wafers from a dedicated FOUP into a jar box.
The Auto Jar Unpacking System automatically transfers and unpacks wafers from the jar box into the desired wafer cassette.
Specification
| Applications | Wafer jar box packing and unpacking |
|---|---|
| applied wafer size | 8" (200mm) 12" (300mm) |
| Weight | 3,800kg |
| Cassette Type | Open CST(P.P. Monsanto, Metal) FOUP, Auto FOSB |
| Throughput | 100 Wafers / Hr |
| Options | FAB Automation, BCR, OCR |
If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email.
E-Mail : smlee@ktsemi.co.kr