Wafer Mounting System
본문
Model
KT-WTM3001A
Automated System for Transporting and Storing Ring
Frames Laminated with Wafer Protection Film for Wafer
Back Grinding.
This system is designed to automatically transport and store Ring Frames
laminated with wafer protection film for Wafer Back Grinding. It supports 12" carriers and wafers, providing fully
automated handling for efficient
processing.
Specification
| Wafer Size | 300mm 12” (Normal Thickness 450~750um) |
|---|---|
| Dimension | 1,897(W) x 2,120(D) x 2,080(H)mm |
| System Control Type | PC Control |
| Carrier Application | FOUP, Ring Magazine |
| Through put | 19 sec / wafer(Without HOST) |
| Cleanness | FFU Class 100 ULPA filter |
| Attach Tape | Pre-cut, UV Cure Type |
| Option | BCP Printer, UV Irradiation, Heating chuck |
* FAB Automation: OHT, AGV with HOST
If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email.
E-Mail : smlee@ktsemi.co.kr